Thermal testing laboratory
BME Building Q; H-1117 Budapest, Magyar Tudósok krt. 2. QB334
Research keywords:
· multi-domain modeling
· LED characterisation
· thermal transient testing
· WEISS climate chamber
· lifetime modeling
· reliability testing
· digital twinning
Equipment
SIEMENS Thermal Transient Tester aka. T3STer, SIEMENS TeraLED measurement instrument, Light integrating spheres, WEISS climate chamber, High repcision and high reliability JULABO thermostats, FLIR IR imaging of decapsulated integrated circuits and complete electronic components
Potential purposes of experimentation
Electrical, thermal and optical characterisation and modeling of semiconductor devices. Reliability testing, lifetime modeling and system level digital twinning beyond simulation. Steady state and transient thermal imaging. Active and passive thermal cycling of semiconductor devices enhanced with automated intermittent thermal transient characterisation.
Services for external users
- Research availability
- Commercial availability (industrial applications)
- Training availability
Relevant publications
A. Poppe, G. Hantos, J. Hegedüs, P. Csuti and M. Rencz, "Concepts for high throughput LED testing using high-speed optical transients of LEDs," 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Dublin, Ireland, 2022, pp. 1-7, doi: 10.1109/THERMINIC57263.2022.9950671.J. Hegedüs, G. Hantos, M. Lukács, B. Bodnár, G. Lipák and A. Poppe, "Thermal characterization issues of LEDs during reliability testing," 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Dublin, Ireland, 2022, pp. 1-5, doi: 10.1109/THERMINIC57263.2022.9950652.
L. Pohl, M. Németh, J. Hegedűs, G. Hantos, Z. Kohári and A. Poppe, "Multi-Domain Modelling and Simulation of White CoB LEDs," 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Lecco, Italy, 2019, pp. 1-7, doi: 10.1109/THERMINIC.2019.8923856.
G. Hantos, J. Hegedüs, M. Rencz and A. Poppe, "Aging tendencies of power leds under different humidity conditions during thermal reliability testing," 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Paris, France, 2015, pp. 1-4, doi: 10.1109/THERMINIC.2015.7389624.