I am looking for partners in the research area.

I am looking for partners interested in the Horizon Europe Call.

I am looking for partners for the Horizon Europe research area.

I am looking for laboratory facilities in the research/application area.

Microelectronics Reliability and Failure Analysis

Research keywords: · corrosion · reliability · quality · fault analysis · metallography · traceability
Horizon Europe keywords: · Artificial Intelligence and Robotics · Health technologies, new tools and solutions · Next generation computing and data technologies · Semiconductors

Faculty of Electrical Engineering and Informatics Department of Electron Devices

Introduction of the Research Group

The research group deals with the quality and reliability problems of electronic products and components, as well as their physical failure mechanisms. The strength of the research group is that its researchers require interdisciplinary knowledge and have a strong foundation in electronic manufacturing technology.

 As well as we engage in research topics that will determine industrial interest in the long term. The results achieved by the research group are directly used in the practice of the electronics manufacturing industry.


Achievements Publications Awards Journals Projects Conferences

Achievements

The research group achieved results in the field of understanding long-term failure mechanisms (e.g. electrochemical migration, whisker formation) during the operation of the products, and also developed material science methods used in the analysis of the products.

Publications


Awards

2015-2018 Bolyai Scholarship

2016-2019 PD - OTKA

Journals

MICROELECTRONICS RELIABILITY

INTERNATIONAL JOURNAL OF PHARMACEUTICS

MATERIALS SCIENCE FORUM

CORROSION SCIENCE

JOURNAL OF ALLOYS AND COMPOUNDS

SURFACE AND COATINGS TECHNOLOGY

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

SOLDERING & SURFACE MOUNT TECHNOLOGY

RSC ADVANCES

JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS

METALS

MATERIALS

VACUUM

PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE

Projects

2016-19 METALLOGLOBUS FÉMÖNTŐ KFT. Solderability tests


Conferences

EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)

International Spring Seminar on Electronics Technology (ISSE)

International Symposium for Design and Technology in Electronic Packaging (SIITME)

EUROCORR – The European Corrosion Congress